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The Vital Function Of Solder Paste Printing In New Product Intro


Surface mount assembly (SMT) carries a crucial role to try out in the Awesome Introduction (NPI) process for electronics manufacturing.

The top degree of automation inside the SMT methodology comes with a variety of advantages, from automatic correction of errors, to simpler and faster assembly, better mechanical performance, increased production rates and reduced labour costs.

The SMT assembly process to have an electronics manufacturing services (EMS) provider could be broken down into four key stages:

Solder Paste Printing
Pick and set
Oven Profiling
Automated Optical Inspection (AOI)
Depending on the complexity from the design, or perhaps your own outsourcing strategy, your product could go through all these processes therefore, or else you may find that you simply omit a stride or two.

You want to highlight the precise attributes, and also the vital importance, of the solder paste printing process on your NPI.

Trying to your specifications
The initial step on your EMS provider can be to analyse the pcb (PCB) data which is specific to your order, to make sure that they select the required stencil thickness along with the the most appropriate material.

Solder paste printing is among the most common way of applying solder paste with a PCB. Accurate solder paste application is hugely crucial in avoiding assembly defects which may possess a knock on effect further down the production process. So it is vital that this key stage is correctly managed and controlled because of your EMS partner.

Solder paste is actually powdered solder which was suspended in a thick medium called flux. The flux provides a sort of temporary adhesive, holding the parts in place prior to the soldering process begins. Solder paste is applied to the PCB by using a stencil (generally stainless steel, but occasionally nickel,) then as soon as the solder is melted it forms an electrical/mechanical connection.

The thickness with the stencil is the thing that determines the level of solder applied. For many projects it may also be required to have a lot of thicknesses in several areas within the one stencil (known as a multi-level stencil).

Another main factor to think about from the solder printing process is paste release. The right type of solder paste must be selected based on how big the apertures (or holes) within the stencil. If your apertures are extremely small, as an example, then your solder paste could be quite likely going to sticking to the stencil instead of adhering correctly towards the PCB.

Governing the rate of paste release however can be simply managed, either start by making changes for the kind of the aperture or by lessening the thickness with the stencil.

The solder paste that is used may also effect on a final top printing quality, therefore it is important to pick the appropriate blend of solder sphere size and alloy for that project, and help it become mixed to the correct consistency before use.

Ensuring quality
As soon as the stencil has been designed as well as your EMS partner is able to generate the first PCB, they'll next want to consider machine settings.

Quite simply, the flatter you can the PCB from the printing process, the better final results will probably be. So by fully supporting the PCB in the printing stage,either through automated tooling pins or having a dedicated support plate, your EMS provider can remove the potential for any defects including poor paste deposit or smudging.

It's also important to take into account the speed and pressure with the squeegees through the printing process. One solution can be to have one speed for that solder paste but to own varying degrees of pressure, in line with the unique specifications from the PCB as well as the whole squeegee.

Washing the stencils, both just before and throughout production, can also be essential in ensuring qc. Many automatic printing machines possess a system that could be set to clean the stencil from a fixed variety of prints which will help to stop smudging, and prevents any blockages in the apertures.

Finally too, the printers really should have a built-in inspection system (for example Hawk-Eye optical inspection) which can be preset to evaluate a good paste throughout the whole PCB after printing.

The solder paste printing process is a precise and detailed one which have a significant part to learn within the ultimate success of your cool product. And, because this blog post highlights, a huge amount of detailed work is planning to occur c = continual reporting before your EMS partner solders the 1st electronic ingredient of a board.

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